Liquid jet head and liquid jet apparatus
AssigneeSeiko Epson Corporation
InventorYutaka Furuhata
Life of this patent
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Abstract
Provided are a liquid jet head and a liquid jet apparatus in which it is possible to securely connect drawn wires and connection wires and to improve reliability. Connection portions 91 of drawn wires 90 drawn from piezoelectric elements 300 and pad portions 101 of a drive IC 100 for driving the piezoelectric elements 300 are connected by connection wires 110 formed by wire bonding and extended in directions intersecting drawing directions of the connection portions 91. Accordingly, the connection wires 110 and the drawn wires 90 are suitably connected.
Claims9
A liquid jet head comprising a passage-forming substrate on which pressure generating chambers communicating with nozzle orifices are formed, and piezoelectric elements including a lower electrode, piezoelectric layers and upper electrodes provided on one side of the passage-forming substrate through a vibration plate;
- wherein connection portions of drawn wires drawn from the piezoelectric elements and pad portions of a drive IC for driving the piezoelectric elements are connected by connection wires formed by wire bonding and extended in directions intersecting drawing directions of the connection portions of the drawn wires;
- and
- wherein the connection portions are provided to be slanted along extension directions of the connection wires from main body portions of the drawn wires, and a width of the connection portions is narrower than a maximum width of bonding regions of the connection wires and equal to or wider than ⅓ of the maximum width.
A liquid jet head comprising a passage-forming substrate on which pressure generating chambers communicating with nozzle orifices are formed, and piezoelectric elements including a lower electrode, piezoelectric layers and upper electrodes provided on one side of the passage-forming substrate through a vibration plate,
- wherein drawn wires drawn from the piezoelectric elements to the passage-forming substrate and pad portions of a drive IC for driving the piezoelectric elements are connected by connection wires formed by wire bonding, and an angle, within a plane substantially parallel to the plane of the passage-forming substrate, between extension directions of the connection wires and extension directions of connection portions, to which the connection wires are connected, of the drawn wires is in a range of 45°±15°.
Dependencies are inferred from the claim text.