Card apparatus and method of producing the same

A method of producing a card apparatus, the card apparatus including a circuit substrate, and a card case arranged to accommodate the circuit substrate, wherein the card case includes a case main body and an extended portion made of resin material and being integral with the case main body, the extended portion accommodating one end of the circuit substrate, the case main body includes a metal cover disposed opposite to at least one of a front surface and a back surface of the circuit substrate, and a metal cover extension extending from the metal cover and including a first conductive plate is embedded in a case wall constituting the extended portion, and a second conductive plate constituting an antenna element is embedded in the case wall constituting the extended portion, the second conductive plate being spaced at a predetermined distance apart from the metal cover extension, the method comprising the steps of:

• obtaining a conductive plate having a structure in which the metal cover extension of the metal cover and the second conductive plate constituting the antenna element are connected by a connecting element;
• subsequently embedding in the case wall constituting the extended portion the metal cover extension and the second conductive plate constituting the antenna element and producing the extended portion having a hole for exposing the connecting element by using injection molding technology;
• and
• subsequently using the hole to cut the connecting element between the metal cover extension and the second conductive plate constituting the antenna element to separate the metal cover extension from the second conductive plate constituting the antenna element.

A method of producing a card apparatus, the card apparatus including a circuit substrate, and a card case arranged to accommodate the circuit substrate, wherein the card case includes a case main body and an extended portion made of resin material and being disposed integrally with the case main body, the extended portion accommodating one end of the circuit substrate, the case main body includes a metal cover disposed opposite to at least one of a front surface and a back surface of the circuit substrate, and a metal cover extension extending from the metal cover and including a first conductive plate is embedded in a case wall constituting the extended portion, and a second conductive plate constituting an antenna element is embedded in the case wall constituting the extended portion, the second conductive plate being spaced at a predetermined distance apart from the metal cover extension, the method comprising the steps of:

• obtaining the second conductive plate constituting the antenna element;
• forming a wall piece on a portion of one of the surfaces of the extended portion by applying and curing resin material on one of a front surface and a back surface of the second conductive plate constituting the antenna element;
• subsequently disposing the wall piece at a predetermined position in a metal mold for injection-molding the extended portion and disposing the metal cover extension at a predetermined position in the metal mold;
• and
• subsequently forming the extended portion in which the metal cover extension and the second conductive plate constituting the antenna element is embedded by injecting resin material for constituting the extended portion into the metal mold to cover the metal cover extension of the metal cover with the resin material and to cover the second conductive plate constituting the antenna element of the wall piece with the resin material.