Apparatus and method for attaching a semiconductor die to a heat spreader
AssigneeIntel Corporation
InventorsJadhav G. Susheel, Daoqiang Lu
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Abstract
Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to receive a number of die, and the die may be held in place on the surface by a flux, the flux being subsequently removed prior to bonding. The apparatus may further include a number of registration elements to hold a heat spreader in a relative position over each die. Other embodiments are described and claimed.
Claims21
A method comprising:
- providing a substantially flat surface having a plurality of registration pins integral therewith and extending away therefrom, the registration pins bounding a portion of the substantially flat surface suitable for receiving a semiconductor die, and further having a first aperture and an opposing second aperture extending into the substantially flat surface, the first and second apertures capable of receiving a spring clip;
- applying a layer of flux to the substantially flat surface;
- placing the semiconductor die on the flux, the flux to inhibit movement of the die;
- placing a thermal component over the die;
- removing the flux;
- bonding the thermal component to the die to form an assembly;
- and
- removing the assembly from the surface.
A method comprising:
- providing a base having a plurality of registration pins integral therewith and extending away therefrom, the registration pins bounding a portion of the base suitable for receiving a semiconductor die, and further having a first aperture and an opposing second aperture extending into the base, the first and second apertures capable of receiving a spring clip;
- applying a layer of flux to a substantially flat upper surface of the base;
- placing a number of semiconductor die on the upper surface, the flux to inhibit movement of each die;
- placing a number of heat spreaders on the base, each heat spreader overlying one of the die;
- removing the flux;
- bonding each heat spreader to the underlying die to form an assembly;
- and
- removing each assembly from the base plate.
An apparatus for bonding a number of heat spreaders with a corresponding number of semiconductor die to form a number of assemblies, comprising:
- a rectangular shaped base plate having a substantially flat upper surface and an opposing lower surface;
- and
- a number of die placement regions disposed on the upper surface of the base plate, each die placement region including
- a portion of the upper surface sufficient in size to receive one of the semiconductor die,
- a number of registration pins permanently attached to and extending from the upper surface, the registration pins to restrict movement of one of the heat spreaders placed over the one semiconductor die in that placement region, each of the registration pins to abut one of a number of edges of the one heat spreader, and
- a first aperture and an opposing second aperture extending into the base plate, the first and second apertures capable of receiving a spring clip for compressing the one heat spreader against the one semiconductor die;
- wherein each of the assemblies is removed from the base plate after a bonding process is performed.
An apparatus for bonding a number of heat spreaders with a corresponding number of semiconductor die to form a number of assemblies, comprising:
- a base plate having a substantially flat upper surface and an opposing lower surface;
- a number of die placement regions disposed on the upper surface of the base plate, each die placement region including a portion of the upper surface sufficient in size to receive one of the semiconductor die, a number of registration pins permanently attached to and extending from the upper surface, and a first aperture and an opposing second aperture extending into the base plate, the first and second apertures capable of receiving a spring clip;
- and
- a cover plate disposable over the base plate, the cover plate including a number of apertures arranged in a pattern corresponding to a pattern of the die placement regions, each aperture to sized to slidably receive one of the heat spreaders;
- wherein each of the assemblies is removed from the base plate after a bonding process is performed.
Dependencies are inferred from the claim text.