Wire bond capillary tip
AssigneeChipPAC, Inc.
InventorsKenny Lee, Hun-Teak Lee, Jong Kook Kim, Chulsik Kim, Ki-Youn Jang
Life of this patent
Estimating the term…
Loading patent…
AssigneeChipPAC, Inc.
InventorsKenny Lee, Hun-Teak Lee, Jong Kook Kim, Chulsik Kim, Ki-Youn Jang
Estimating the term…
A capillary tip for a wire bonding tool has a chamfer provided with at least one annular groove. The annular groove is generally oriented in a plane perpendicular to the axis of the capillary. In a sectional view through the capillary axis, the groove profile may be generally part-oval or part circular, such as semicircular or half-oval; or generally rectangular; or generally triangular. In some embodiments the width of the groove profile at the face of the chamfer is at least about one-tenth, more usually at least about one-fifth, the length of the chamfer face; and less than about one-half, more usually less than about one-third, the length of the chamfer face. In some embodiments two or more such grooves are provided. The grooved chamfer can improve the transmission of ultrasonic energy to the wire ball during formation of the bond.
A capillary for a wire bonding tool, said capillary comprising:
A capillary for a wire bonding tool, said capillary comprising:
A capillary for a wire bonding tool, said capillary comprising:
Dependencies are inferred from the claim text.