Plasma processing method and apparatus

A plasma processing apparatus comprising:

• a vacuum chamber;
• a gas supply unit for supplying gas into the vacuum chamber;
• an exhausting unit for exhausting an interior of the vacuum chamber;
• a pressure-regulating valve for controlling the interior of the vacuum chamber to a specified pressure;
• a substrate electrode for placing thereon a substrate within the vacuum chamber;
• an antenna provided opposite to the substrate electrode;
• and
• a high-frequency power supply capable of supplying a high-frequency power having a frequency of 50 MHz to 3 GHz to the antenna,
• the plasma processing apparatus further comprising:
• a dielectric plate sandwiched between the antenna and a substrate-facing inner surface of the vacuum chamber;
• an antenna cover for covering side surfaces of the antenna and the dielectric plate and a substrate-facing surface of the antenna;
• a slit cover for covering an exposed surface of the substrate-facing inner surface of the vacuum chamber and fixing the antenna cover to an inner wall surface of the vacuum chamber, wherein the antenna cover is supported by the slit cover;
• a heat-conducting sheet provided between the antenna and the antenna cover;
• and
• a refrigerant feed unit for making a refrigerant flow to the antenna.