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US 7,406,759 B2Granted
Releasing method and releasing apparatus of work having adhesive tape
AssigneeNitto Denko Corporation
InventorsMasayuki Yamamoto, Yasuji Kaneshima
Life of this patent
Estimating the term…
Abstract
In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape.
Claims6
A method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the holding member having a plurality of suction holes, the method comprising the steps of:
- sucking the adhesive tape through the holding member by bringing the adhesive tape into surface-to-surface contact with the holding member;
- supplying a gas at a predetermined pressure through the holding member to the adhesive tape, at the same time as the adhesive tape is sucked;
- adjusting at least one of the suction and the pressure for supplying the gas to prevent the adhesive tape from being drawn into the suction holes in the holding member;
- and
- releasing the work having the adhesive tape from the holding member while supplying the gas and sucking.
2 more elements
Dependencies are inferred from the claim text.