Methods of providing families of integrated circuits with similar dies partially disabled using product selection codes

A method of providing a family of packaged programmable integrated circuits (ICs), the method comprising:

• providing a first packaged programmable IC comprising a first programmable IC die mounted in a first package, the first programmable IC die comprising a first portion and a second portion, the first packaged programmable IC comprising a first product selection code enabling programming of both the first portion and the second portion;
• providing a second packaged programmable IC comprising a second programmable IC die mounted in a second package, the second programmable IC die being a duplicate of the first programmable IC die and comprising a first portion and a second portion, the second packaged programmable IC comprising a second product selection code different from the first product selection code, the second product selection code enabling programming of the first portion and disabling programming of the second portion;
• and
• providing a third packaged programmable IC comprising a third programmable IC die mounted in a third package, the third programmable IC die being substantially similar to the first portion of the first IC die.

A method of providing a family of packaged integrated circuits (ICs), the method comprising:

• providing a first packaged IC comprising a first IC die mounted in a first package, the first IC die comprising a first portion, a second portion, and a third portion, the first packaged IC comprising a first product selection code, wherein all of the first portion, the second portion, and the third portion are made operational within the first packaged IC based on the first product selection code;
• providing a second packaged IC comprising a second IC die mounted in a second package, the second IC die being a duplicate of the first IC die and comprising first, second, and third portions corresponding to the first, second, and third portions of the first IC die, the second packaged IC comprising a second product selection code different from the first product selection code, wherein the first portion is made operational within the second packaged IC based on the second product selection code and the second and third portions are rendered non-operational within the second packaged IC based on the second product selection code;
• and
• providing a third packaged IC comprising a third IC die mounted in a third package, the third IC die being a duplicate of the first IC die and comprising first, second, and third portions corresponding to the first, second, and third portions of the first IC die, the third packaged IC comprising a third product selection code different from the first and second product selection codes, wherein the first and second portions are made operational within the third packaged IC based on the third product selection code and the third portion is rendered non-operational within the third packaged IC based on the third product selection code.