Method and system for integrated circuit packaging
AssigneeTexas Instruments Incorporated
InventorHumberto Quezada Mercado
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Abstract
According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die including a second non-planar surface. The first and second non-planar surfaces form the upper and lower surfaces of a mold cavity when the first and second mold press die are engaged. The mold tool also includes a bright TiN coating disposed on the first non-planar surface. The bright TiN coating operates to decrease residue on the first non-planar surface from a mold compound. The mold compound is distributed into the mold cavity to form a package operable to encapsulate an integrated circuit
Claims10
A method of packaging integrated circuits, comprising:
- providing a first mold press die comprising a first non-planar surface coated with bright TiN coating, the bright TiN coating operable to decrease residue on the first non-planar surface from a mold compound;
- providing a second mold press die comprising a second non-planar surface, the first and second non-planar surfaces forming upper and lower surfaces of a mold cavity when the first and second mold press die are engaged;
- and
- forming a package operable to encapsulate an integrated circuit with the mold compound distributed into the mold cavity.
Dependencies are inferred from the claim text.