High-power LGA socket
AssigneeIntel Corporation
InventorDonald T. Tran
Life of this patent
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Abstract
A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped edge, a second scalloped edge and a solid end adapted for insertion into a slot. The solid end and the scalloped edges carry current greater than the current needed for an input/output signal. The socket includes a base having an opening therein adapted to receive the package. A slot is located at one end of the opening in the base. The slot is provided with a plurality of conductors for carrying currents greater than the current needed for an input/output signal. A first edge and second edge of the opening include a plurality of spaced overhangs positioned over the opening. The overhangs are sloped with respect to the major planar surface.
Claims5
A method of connecting a land grid array package including an array of land contacts to a corresponding socket comprising:
- placing the package into an opening in the base of the socket;
- sliding the package over a major planar surface into engagement with a slot in the socket;
- sending input/output signals through the land contacts of the land grid array package;
- and
- sending power to the land grid array package through the slot and portion of the package mating with the slot.
Dependencies are inferred from the claim text.