Heatspreader for single-device and multi-device modules
AssigneeSun Microsystems, Inc.
InventorSeshasayee S. Ankireddi
Life of this patent
Estimating the term…
Abstract
A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider pins secured in one of the holes in the elastomeric base. The alignment frame supporting and aligning the slider pins as the slider pins move in a direction substantially perpendicular to the heatsink base. A method of assembling a heat spreader is also described.
Claims17
A heatsink comprising:
- a heatsink base;
- an elastomeric base including a plurality of holes, the elastomeric base coupled to the perimeter of the heatsink base;
- a plurality of slider pins, each of the slider pins secured in one of the plurality of holes in the elastomeric base;
- an alignment frame coupled to the heatsink base, the alignment frame supporting and aligning the plurality of slider pins as the slider pins move in a direction substantially perpendicular to the heatsink base and;
- at least one cushion spring between the elastomeric base and the alignment frame, the at least one cushion spring located proximate to a perimeter of the plurality of slider pins.
A heatsink comprising:
- a heatsink base;
- an elastomeric base including a plurality of holes, the elastomeric base coupled to the perimeter of the heatsink base;
- a plurality of slider pins, each of the slider pins secured in one of the plurality of holes in the elastomeric base;
- an alignment frame coupled to the heatsink base, the alignment frame supporting and aligning the plurality of slider pins as the slider pins move in a direction substantially perpendicular to the heatsink base;
- at least one cushion spring between the elastomeric base and the alignment frame, the at least one cushion spring located proximate to a perimeter of the plurality of slider pins;
- and
- a captivated heat transfer material contained in a cavity between the elastomeric base and the heatsink base;
- wherein the heatsink is coupled to a substrate and wherein the substrate includes:
- a heat source mounted on the substrate;
- and
- a quantity of thermal interface material between the heat source and the plurality of slider pins, the plurality of slider pins compressing the thermal interface material to a desired bondline thickness.
A method of assembling a heat spreader comprising:
- dispensing a desired quantity of thermal interface material to a heat source mounted on a substrate;
- positioning the heat spreader in a desired position, wherein the heat spreader includes:
- a heatsink base;
- an elastomeric base including a plurality of holes, the elastomeric base coupled to the perimeter of the heatsink base;
- a plurality of slider pins, each of the slider pins secured in one of the plurality of holes in the elastomeric base;
- an alignment frame coupled to the heatsink base, the alignment frame supporting and aligning the plurality of slider pins as the slider pins move in a direction substantially perpendicular to the heatsink base wherein the desired position aligns the plurality of slider pins with a heat source;
- and
- at least one cushion spring between the elastomeric base and the alignment frame, the at least one cushion spring located proximate to a perimeter of the plurality of slider pins;
- and
- applying a compression load to the heat spreader to compress the heat spreader to the substrate until the thermal interface material has a desired bondline thickness.
Dependencies are inferred from the claim text.