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US 7,397,116 B2Granted
Semiconductor apparatus and production method thereof suitable for electric power devices
AssigneeKabushiki Kaisha Toyota Jidoshokki
InventorsHiroyuki Onishi, Toshiaki Nagase, Jun Ishikawa, Koichi Akagawa
Life of this patent
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Abstract
A semiconductor apparatus is characterized in that it comprises a semiconductor module having a plurality of semiconductor elements and an external connection terminal for externally connecting electrodes of the semiconductor elements in the semiconductor module, wherein the semiconductor elements in each semiconductor module are connected in parallel and/or in series via the external connection terminal.
Claims4
A semiconductor apparatus, comprising:
- a semiconductor module having a plurality of semiconductor elements;
- and
- an external connection terminal for externally connecting electrodes of the semiconductor elements in the semiconductor module, wherein
- the external connection terminal comprises a first external connection terminal for externally connecting first electrodes of the semiconductor elements and a second external connection terminal for externally connecting second electrodes of the semiconductor elements,
- the semiconductor elements in each semiconductor module are externally connected in parallel, and
- a sheet-shaped insulation part is provided between the first external connection terminal and the second external connection terminal.
3 more elements
A semiconductor apparatus comprising:
- first and second semiconductor modules each having at least one semiconductor element;
- a case for storing the first and second semiconductor modules;
- and
- a plurality of terminal conductors for deriving a main electrode of each semiconductor module to an outside of the case, wherein
- the terminal conductors of the first semiconductor module and the second semiconductor module can be connected in parallel via an external connection terminal,
- the external connection terminal comprises a first external connection terminal for externally connecting terminal conductors of first electrodes of each semiconductor module and a second electrode external connection terminal for externally connecting terminal conductors of second electrodes of each semiconductor module, and
- a sheet-shaped insulation part is provided between the first external connection terminal and the second external connection terminal.
4 more elements
Dependencies are inferred from the claim text.