Class of volatile compounds for the deposition of thin films of metals and metal compounds

Abstract

The invention provides an organometallic complex, containing oxygen free organic ligands, for the deposition of a metal, preferably copper, silver or gold, and preferably by way of chemical vapor deposition. The organometallic complex having the formula [(Do)nMLx]k where M is a metal preferably selected from the group consisting of Cu, Ag and Au; Do is selected from the group comprising ethers, phosphines, olefins, sulfides, pyridines, carbonyl, hydroxyl, cyclopentadiene, benzene derivatives, allyls, alkyls, amines, polyamines, aniline derivatives, cyclooctadiene and combinations thereof; n is an integer having a value from 0 to 4; k is an integer having a value from 1 to 4; x is an integer having a value from 1 to 4; and L is an amidinate ligand of the formula R1—NC(R2)N—R3 where R1, R2 and R3 are selected from the group consisting of alkyls, allyls, aryls, heteroaryls, hydrogen, non-metals and metalloids; and where R1, R2 and R3 are different or the same.

Dependencies are inferred from the claim text.