Method for contacting parts of a component integrated into a semiconductor substrate
AssigneeInfineon Technologies AG
InventorsLudwig Dittmar, Wolfgang Gustin, Maik Stegemann
Life of this patent
Estimating the term…
Abstract
The invention relates to a method for contacting parts of a component integrated into a semiconductor substrate (1). According to the inventive method, a first contact hole is produced in an insulating layer (2), said contact hole being then filled with contact material (16) and connected to a line. The aim of the invention is to minimise the processes required for contacting parts of a component integrated into a semiconductor substrate. To this end, the hard mask (3) used to produce the contact hole is also used to structure the line.
Claims14
A method of forming electrically connected contacting parts of a component integrated into a semiconductor substrate, the method comprising:
- providing a hard mask patterned over an insulating layer to define a contact hole;
- forming said contact hole in said insulating layer;
- filling the contact hole with an ARC layer that also overlies said patterned hard mask and the insulating layer;
- depositing and patterning a photoresist layer on said ARC layer;
- removing portions of the ARC layer and portions of the hard mask not covered by the photoresist layer to repattern said hard mask to define a conductive line trench;
- removing portions of the insulating layer to form said conductive line trench;
- removing the ARC layer from the contact hole;
- and filling the contact hole and said conductive line trench with contact material so that the filled contact hole and the conductive line trench are electrically connected.
A method of forming a contact hole and a conductor trench connecting to said contact hole in an insulating layer using a common hard mask, the method comprising:
- providing said insulating layer;
- providing said hard mask, said hard mask patterned to form said contact hole;
- etching said contact hole in said insulating layer;
- covering said insulating layer with an ARC layer to fill said contact hole;
- re-patterning said hard mask subsequent to said step of covering said insulating layer with said ARC layer to define said conductor trench connected to said contact hole;
- etching said conductor trench in said insulating layer according to said re-pattered hard mask;
- and
- filling said contact hole and said conductor trench with a conductive material such that said conductive material in said conductor trench and said contact hole are electrically connected.
Dependencies are inferred from the claim text.