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US 7,396,734 B2Granted
Substrate manufacturing method
AssigneeCanon Kabushiki Kaisha
InventorRyuji Moriwaki
Life of this patent
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Abstract
In a method of manufacturing a bonded substrate stack by bonding the bonding surfaces of the first and second substrates, a bonding surface having a hydrophobic region and a hydrophilic region is formed by partially processing at least one of the bonding surfaces of the first and second substrates, and then the bonding surfaces of the first and second substrates are bonded to each other.
Claims12
A substrate manufacturing method of manufacturing a bonded substrate stack by bonding a bonding surface of a first substrate and a bonding surface of a second substrate, comprising steps of:
- partially processing at least one of the bonding surface of the first substrate and the bonding surface of the second substrate to form both a hydrophobic region on an outermost area of at least one of the first and second substrates and a hydrophilic region on a central portion of the at least one of the first and second substrates framed by the hydrophobic region;
- and
- bonding the bonding surface of the first substrate and the bonding surface of the second substrate.
Dependencies are inferred from the claim text.