Methods and systems for providing MEMS devices with a top cap and upper sense plate
AssigneeHoneywell International Inc.
InventorsRobert D. Horning, Jeffrey A. Ridley
Life of this patent
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Abstract
A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.
Claims11
A method for fabricating a micro-electromechanical systems (MEMS) device having a top cap and an upper sense plate, said method comprising:
- producing a device wafer including an etched substrate, etched silicon, and interconnect metal, a portion of the interconnect metal being bond pads;
- adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer;
- producing an upper wafer including an etched substrate and interconnect metal;
- bonding the device wafer and the upper wafer;
- and
- dicing the bonded upper wafer and device wafer into individual MEMS devices,
- wherein producing the device wafer includes forming a support ring around a perimeter of the MEMS device components, the support ring arranged to support the upper wafer.
A method for preventing electrical shorts in a MEMS device including at least one electrical interconnection passing under a support ring, the electrical interconnection being in a recessed trench and a material filling the trench onto which the support ring is mounted, said method comprising forming a protective shield near the support ring, the shield substantially preventing incidents of particles shorting the support ring to the electrical interconnection.
Dependencies are inferred from the claim text.