Multiple internal seal ring micro-electro-mechanical system vacuum packaging method

A method of fabricating a device package, comprising:

• (a) metal patterning of at least one seal ring on a base plate;
• (b) aligning of the base plate and a resonator plate;
• (c) bonding of the base plate and resonator plate using heat and pressure in an evacuated chamber;
• (d) etching of bulk electrodes on the resonator plate, wherein the doped silicon or a metalization of the resonator plate provides a conductive path for the electrodes;
• (e) etching of at least one via hole in a capping plate;
• (f) metal patterning of at least one seal ring on a bottom surface of the capping plate;
• (g) aligning of the resonator plate and capping plate, and more specifically, the aligning of the bulk electrodes of the resonator plate with the seal rings of the capping plate;
• (h) bonding of the of the resonator plate and capping plate using heat and pressure in an evacuated chamber.
• (i) electro-less plating of a thin metal layer on a top surface of the capping plate including inside the via holes;
• (j) electroplating of a thicker metal layer on the thin metal layer;
• (k) masking and etching of an electrical trace pattern on the top surface of the capping plate.