Single crystal, single crystal wafer, epitaxial wafer, and method of growing single crystal
AssigneeShin-Etsu Handotai Co., Ltd.
InventorsRyoji Hoshi, Susumu Sonokawa
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AssigneeShin-Etsu Handotai Co., Ltd.
InventorsRyoji Hoshi, Susumu Sonokawa
Estimating the term…
There is disclosed a single crystal obtained by a single crystal pulling method, wherein an interval of striations incorporated into the single crystal due to temperature fluctuation of crystal melt at the time of crystal growth is controlled, and a method of growing a single crystal according to a single crystal pulling method, wherein a growth rate and/or a temperature fluctuation period are controlled so that V×F/sin θ may be in a certain range when a growth rate at the time of growing a single crystal is defined as V (mm/min), a temperature fluctuation period of crystal melt is defined as F (min), and an angle to the level surface of a crystal-growth interface is defined as θ. Thereby nanotopology characteristics can be improved from aspects different from the processing conditions of the surface of the wafer and there can be provided a single crystal which can produce a wafer excellent in nanotopology characteristics, especially in nanotopology characteristics measured in 2 mm×2 mm square, and a method of growing a single crystal for growing the single crystal.
A silicon single crystal manufactured by a single crystal pulling method, wherein an interval of striations incorporated into the single crystal due to temperature fluctuation of crystal melt at the time of crystal growth is controlled, the interval of striations is in a range of 1.5 mm or less or 2.3 mm or more in a plane perpendicular to an axis of crystal growth, the resistivity of the single crystal is 0.1 Ω·cm or less, and nanotopology characteristics are controlled.
A method of growing a silicon single crystal according to a single crystal pulling method, wherein a growth rate and/or a temperature fluctuation period are controlled so that V×F/sin θ is in a certain range when a growth rate at the time of growing a single crystal is defined as V (mm/mm), a temperature fluctuation period of crystal melt is defined as F (mm), an angle to the level surface of a crystal-growth interface is defined as θ, and a resistivity of the single crystal silicon is set to 0.1 Ω·cm or less.
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