Electroless gold plating solution
AssigneeNippon Mining & Metals Co., Ltd.
InventorsAkihiro Aiba, Kazumi Kawamura, Hirofumi Takahashi
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Abstract
The invention provides a displacement electroless gold plating solution that is low in toxicity, can be used at a pH near to neutrality, and affords good solder adhesion and film adhesion. The displacement electroless gold plating solution contains a non-cyanide water-soluble gold compound and a hydrogensulfite compound. Preferably, the plating solution further contains a thiosulfuric acid compound or an aminocarboxylic acid compound. Sodium hydrogensulfite, potassium hydrogensulfite, ammonium hydrogensulfite or the like can be used as the hydrogensulfite compound.
Claims3
A displacement electroless gold plating solution, characterized by containing a non-cyanide water-soluble gold compound and a hydrogensulfite compound.
Dependencies are inferred from the claim text.