Contact maker for power semiconductor modules and disc cells

A contact system, for electrically engaging a gate terminal of a power semiconductor component having a counter-support recess proximate said gate terminal, comprising:

• at least spring means for enabling an elastic electrical engagement between a contact surface of said gate terminal and an external connecting member;
• said spring means providing an elastic urging force oriented substantially orthogonal to said contact surface;
• a reduced profile contact member projecting from a first gate terminal-contact-end of said spring means distal said external connecting member;
• means for insulating said spring means and said reduced profile contact member from unintended electrical contact with other than said contact surface and said external connecting member;
• and
• said means for insulating includes at least one means for forming a snap-lock connection with said counter-support recess proximate said gate terminal, whereby said snap-lock connection prevents an unintended electrical separation of said contact system from said contact surface during a use, wherein said reduced profile contact member and said contact system enable a size reduction of a contact region of said contact surface.

A contact maker assembly unit for electrically contacting a gate terminal of a power semiconductor component in an electronic device, said gate terminal having a shaped member with a receiving recess proximate said gate terminal incorporating a counter-support geometry, said contact apparatus incorporating:

• a contact spring unit providing an elastic urging contact force oriented substantially orthogonal to a contact surface of said gate terminal;
• said contact spring unit having a contact extension at a first spring end for contacting said contact surface and a spring coil at a second barrel-spring end distal said gate terminal;
• said contact extension occupying a smaller contact area on said contact surface of said gate terminal than an area determined by an outer boundary of said spring coils;
• means for electrically connecting an external electrical connection to said second end of said contact spring unit;
• insulating sleeve means for electrically insulating said contact spring unit from unintended electrical connection and for enabling a snap-lock connection with said counter-support geometry;
• and
• means for preventing an unintended separation of said contact spring unit from said insulating sleeve means prior to said snap-lock connection, whereby said contact system enables ready assembly automation of electrically engaging said gate terminal of said power semiconductor component at a reduced size.