Compliant thermal interface structure utilizing spring elements
AssigneeInternational Business Machines Corporation
InventorsJohn P. Karidis, Mark D. Schultz, Bucknell C. Webb
Life of this patent
Estimating the term…
Abstract
A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements provide mechanical compliance. In one alternative, the structure further includes a solid heat-conducting layer disposed over the electronic device, wherein the plurality of spring elements are coupled to the solid heat-conducting layer.
Claims19
A structure for cooling an electronic device, comprising:
- a top layer disposed over the electronic device;
- and
- a plurality of spring elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements provide mechanical compliance;
- wherein at least one of said spring elements has at least one section with a smaller contact area that gradually increases in cross section to the full cross section of the spring element to prevent the end of the spring elements from adding unwanted rigidity to the structure for cooling with minimal thermal resistance.
A structure for cooling an electronic device, comprising:
- a rigid top layer disposed over the electronic device;
- a plurality of spring elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and
- wherein the plurality of spring elements provide mechanical compliance;
- and
- any one of a liquid and semi-solid thermal interface material disposed between the plurality of spring elements;
- wherein at least one of said spring elements has at least one section having a smaller contact area that gradually increases in cross section to the full cross section of the spring element to prevent the end of the spring elements from adding unwanted rigidity to the structure for cooling with minimal thermal resistance.
An information processing system comprising
- a processor;
- a memory;
- an input/output subsystem;
- a bus coupled to the processor, memory;
- and input/output subsystem;
- and
- a cooling structure for cooling the processor, the cooling structure comprising:
- a top layer disposed over the electronic device;
- and
- a plurality of spring elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements provide mechanical compliance;
- wherein at least one of said spring elements has at least one section with a smaller contact area that gradually increases in cross section to the full cross section of the spring element to prevent the end of the spring elements from adding unwanted rigidity to the structure for cooling with minimal thermal resistance.
Dependencies are inferred from the claim text.