System method and structure for determining focus accuracy
AssigneeKLA-Tencor Corporation
InventorsVladimir Levinski, Michael E. Adel
Life of this patent
Estimating the term…
Abstract
Within a lithography process having a critical dimension, a method, system and structure for determining a focus deviation value relative to an ideal focus position said is disclosed. By projecting a series of lines or spots characterized by the constant pitch size which is greater than the projection devise optical resolution and incrementally increasing widths onto the surface of the photoactive material, wherein the width of at least one of the lines or sports is substantially the same as the critical dimension, and the widths of the other lines or spots are substantially equally distributed around the critical dimension, approximate focus and exposure dose deviation values may be determined.
Claims8
A method of estimating a focus deviation value of a lithographic process, comprising:
- providing a focus masking structure comprising a plurality of lines or spots having incrementally increasing widths, wherein the width of at least one of the lines or spots is substantially the same as a critical dimension of the lithographic process and the widths of the other lines or spots are substantially equally distributed around the critical dimension, wherein the focus masking structure is configured to produce a focus pattern that changes with the focus of the lithography process;
- using the focus masking structure in a lithographic process having a first focus value so as to produce a first focus pattern in a photoreactive material;
- and
- analyzing the first focus pattern to determine how much the first focus value deviates from an ideal focus value.
A lithography system having a critical dimension, said system comprising;
- an illumination source adapted to project energy through a focus masking structure onto a photoactive surface to form a focus pattern;
- an image sensor for detecting an image of the focus pattern;
- and
- a computing unit configured to perform the following operations:
- using a focus masking structure in a lithographic process having a first focus value so as to project energy from the illumination source through the focus masking structure to thereby produce a first focus pattern in a photoreactive material, wherein the focus masking structure comprises a plurality of lines or spots having incrementally increasing widths, wherein the width of at least one of the lines or spots is substantially the same as the critical dimension and the widths of the other lines or spots are substantially equally distributed around the critical dimension, wherein the focus masking structure is configured to produce a focus pattern that changes with the focus of the lithography process;
- and
- using the image sensor to analyze an image of the first focus pattern to determine how much the first focus value deviates from an ideal focus value.
Dependencies are inferred from the claim text.