Back to results
US 7,352,071 B2Granted
Method of fabricating anti-warp package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorKuo-Chung Yee
Life of this patent
Estimating the term…
Abstract
An anti-warp package comprising a packaging substrate, a chip and a stiffening member is provided. The chip is disposed on a top surface of the packaging substrate. The stiffening member is disposed on a bottom surface of the packaging substrate in a location underneath the surrounding area of the chip. Through the disposition of a stiffening member, warping stress on the packaging substrate when the chip is encapsulated by molding compound is counterbalanced.
Claims20
A method of fabricating a package, comprising the steps of:
- providing a packaging substrate having a top surface and a bottom surface, wherein the top surface has at least a chip-disposing region;
- disposing a plurality of chips on the chip-disposing region;
- disposing at least a stiffening member on the bottom surface of the packaging substrate, wherein the stiffening member is disposed underneath a peripheral area encircling the chip-disposing region without overlapping with the chips;
- forming an encapsulant to encapsulate the chips on the packaging substrate;
- and
- sawing the packaging substrate along lines between the chips and the stiffening member to form a package unit, wherein the stiffening member underneath the peripheral area is concurrently removed while sawing the packaging substrate, and said package unit encapsulates at least one chip.
3 more elements
A method of fabricating a package, comprising the steps of:
- providing a packaging substrate having a top surface end a bottom surface, wherein the top surface has a plurality of chip-disposing regions;
- disposing an array of chips on each of the chip-disposing regions;
- disposing a plurality of stiffening members on the bottom surface of the packaging substrate, wherein each stiffening member is disposed underneath a peripheral area encircling each chip-disposing region without overlapping with the array of chips;
- forming an encapsulant to encapsulate the chips and the stiffening members on the top and bottom surfaces of the packaging substrate;
- and
- sawing the packaging substrate along the lines between the array of chips and the stiffening member to form a package unit, wherein the stiffening member at the peripheral area is concurrently removed while sawing the packaging substrate, and said package unit encapsulates at least one chip.
3 more elements
Dependencies are inferred from the claim text.