Method of forming a substantially closed void
AssigneeAviza Technology, Inc.
InventorJohn MacNeil
Life of this patent
Estimating the term…
Abstract
To form a substantially closed void between two structures on a substrate, a flowable liquid dielectric material is deposited to fill partially the space between the structures, and a surface is placed to bridge and substantially close the space between the structures. The substrate is then inverted whilst maintaining the bridge and the deposited material is allowed to flow down to be substantially supported by the surface. The material is set in its substantially supported position, and the surface is removed.
Claims16
A method of forming a substantially closed void between two structures on a substrate, the two structures defining a space there between, the space including an opening opposite a closed bottom surface, said method comprising:
- (a) depositing a flowable liquid dielectric material to fill partially the space between the structures;
- (b) placing a surface to bridge and substantially close the opening of the space between the structures;
- (c) inverting the substrate whilst maintaining the bridge and allowing the deposited material to flow down to be substantially supported by the surface, wherein a closed void is formed between the material in its substantially supported position and the closed bottom surface of the space between the structures;
- (d) setting the material in its substantially supported position;
- and
- (e) removing the surface.
Dependencies are inferred from the claim text.