Electronics assembly having multiple side cooling and method
AssigneeDelphi Technologies, Inc.
InventorsRalph S. Taylor, Michael A. Jeter, Erich W. Gerbsch, Jeffrey J. Ronning
Life of this patent
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Abstract
An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device positioned in thermal communication with the first side surface of the electronics package, and a second heat sink device positioned in thermal communication with the second side surface of the electronics package.
Claims21
An electronics assembly comprising:
- a substrate;
- at least one electronics package supported on the substrate, said electronics package comprising electrical circuitry and first and second side surfaces;
- a first heat sink device positioned in thermal conductive communication with the first side surface of the electronics package, wherein the first heat sink device comprises a fluid vessel containing fluid in an internal flow configuration;
- a second heat sink device positioned in thermal conductive communication with the second side surface of the electronics package, wherein the second heat sink device comprises a fluid vessel containing fluid in an internal flow configuration;
- a first thermal conductive medium disposed between the first side surface of the electronics package and the first heat sink device and in contact with the electronics package and the first heat sink device;
- and
- a second thermal conductive medium disposed between the second side surface of the electronics package and the second heat sink device and in contact with the electronics package and the second heat sink device.
An automotive electronics assembly comprising:
- a circuit board substrate;
- at least one electronics package supported on the substrate, said electronics package comprising electrical circuitry and opposite first and second side surfaces;
- a first heat sink device positioned in thermal conductive communication with the first side surface of the electronics package;
- a second heat sink device positioned in thermal conductive communication with the second side surface of the electronics package, wherein the first and second heat sink devices each comprises a fluid vessel containing a cooling fluid in an internal flow configuration;
- a first thermal conductive medium disposed between the first side surface of the electronics package and the first heat sink device and in contact with the electronics package and the first heat sink device;
- and
- a second thermal conductive medium disposed between the second side surface of the electronics package and the second heat sink device and in contact with the electronics package and the second heat sink device.
A method of cooling electronics in an electronics assembly, said method comprising the steps of:
- providing at least one electronics package supported on a substrate;
- providing a first thermal conductive medium in contact with a first side surface of the electronics package;
- disposing a first heat sink device in thermal conductive communication with the first side surface of the electronics package, wherein the first heat sink device is in contact with the first thermal conductive medium;
- providing a second thermal conductive medium in contact with a second side surface of the electronics package;
- disposing a second heat sink device in thermal conductive communication with the second side surface of the electronics package, wherein the second heat sink device is in contact with the second thermal conductive medium;
- and
- cooling the electronics package by flowing cooling fluid through the first and second heat sink devices to dissipate heat away from the first and second side surfaces of the electronics package, wherein the first and second heat sink devices each comprises a fluid flow vessel with an internal flow configuration.
Dependencies are inferred from the claim text.