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US 7,287,320 B2Granted
Method for programming a routing layout design through one via layer
AssigneeFaraday Technology Corp.
InventorsHsin-Shih Wang, Shang-Jyh Shieh, Ming-Hsin Ku
Life of this patent
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Abstract
A method for programming a routing layout design through one via layer includes forming a plurality of metal traces on a first routing layer and a second routing layer, and positioning a plurality of vias within a via layer disposed between the first and second routing layers for connecting the metal traces on the first and second routing layers according to a first current route defined by a predetermined circuit layout design to connect a first node and a second node so as to establish a second current route equivalent to the first current route.
Claims15
A method for fabricating a routing layout design, the method comprising:
- (a) forming a plurality of metal traces on a first routing layer and a second routing layer, comprising:
- positioning a plurality of first conducting wires and a plurality of second conducting wires on a plurality of horizontal tracks and a plurality of vertical tracks of the first routing layer respectively;
- and
- positioning a plurality of third conducting wires and a plurality of fourth conducting wires on a plurality of horizontal tracks and a plurality of vertical tracks of the second routing layer respectively, the third conducting wire on a kth horizontal track of the second routing layer vertically overlapping the first conducting wire on the kth horizontal track of the first routing layer;
- and
- (b) positioning a plurality of vias within a via layer disposed between the first and second routing layers for connecting the metal traces on the first and second routing layers according to a first current route defined by a predetermined circuit layout design used for connecting a first node and a second node so as to establish a second current route equivalent to the first current route.
3 more elements
A method for fabricating a routing layout design, the method comprising:
- (a) forming a plurality of metal traces on a first routing layer and a second routing layer, comprising:
- positioning a plurality of first conducting wires and a plurality of second conducting wires on a plurality of horizontal tracks and a plurality of vertical tracks of the first routing layer respectively;
- and
- positioning a plurality of third conducting wires and a plurality of fourth conducting wires on a plurality of horizontal tracks and a plurality of vertical tracks of the second routing layer respectively, the third conducting wire on an mth horizontal track of the second routing layer partially overlapping the second conducting wire on an nth vertical track of the first routing layer;
- and
- (b) positioning a plurality of vias within a via layer disposed between the first and second routing layers for connecting the metal traces on the first and second routing layers according to a first current route defined by a predetermined circuit layout design used for connecting a first node and a second node so as to establish a second current route equivalent to the first current route.
3 more elements
A method for fabricating a routing layout design, the method comprising:
- (a) forming a plurality of metal traces on a first routing layer and a second routing layer, comprising:
- positioning a plurality of first conducting wires and a plurality of second conducting wires on a plurality of horizontal tracks and on a plurality of vertical tracks of the first routing layer respectively;
- and
- positioning a plurality of third conducting wires and a plurality of fourth conducting wires on a plurality of horizontal tracks and on a plurality of vertical tracks of the second routing layer respectively, the fourth conducting wire on an rth vertical track of the second routing layer partially overlapping the second conducting wire on the rth vertical track of the first routing layer;
- and
- (b) positioning a plurality of vias within a via layer disposed between the first and second routing layers for connecting the metal traces on the first and second routing layers according to a first current route defined by a predetermined circuit layout design used for connecting a first node and a second node so as to establish a second current route equivalent to the first current route.
3 more elements
A method for fabricating a routing layout design, the method comprising:
- (a) forming a plurality of metal traces on a first routing layer and a second routing layer, comprising:
- positioning a plurality of first conducting wires and a plurality of second conducting wires on a plurality of horizontal tracks and on a plurality of vertical tracks of the first routing layer respectively;
- and
- positioning a plurality of third conducting wires and a plurality of fourth conducting wires on a plurality of horizontal tracks and on a plurality of vertical tracks of the second routing layer respectively, the fourth conducting wire on an sth vertical track of the second routing layer partially overlapping the first conducting wire on a tth horizontal track of the first routing layer;
- and
- (b) positioning a plurality of vias within a via layer disposed between the first and second routing layers for connecting the metal traces on the first and second routing layers according to a first current route defined by a predetermined circuit layout design used for connecting a first node and a second node so as to establish a second current route equivalent to the first current route.
3 more elements
Dependencies are inferred from the claim text.