Mask defect analysis system

A method of evaluating the effect of defects on masks for semiconductor wafers, said method comprising the steps of:

• inspecting a mask for defects using an inspection tool;
• recording defect inspection data from the inspection tool;
• accessing design data from a design data repository corresponding to a level of a mask layer being inspected;
• modifying said design data for said level of a mask layer according to said defect inspection data;
• analyzing said modified design data;
• classifying the defects into critical defects and non-critical defects based on the analyzing;
• and
• determining a final disposition of the mask by applying different acceptance rules to the critical defects and the non-critical defects.

A system for evaluating the effect of defects in masks for semiconductor wafers during pre-shipment inspection and pre-acceptance inspection of masks for semiconductor wafers, said system comprising:

• an inspection tool for inspecting a mask for defects;
• a recording medium for storing said defect inspection data from the inspection tool;
• a design data repository containing design level data for a level of a mask layer being inspected;
• a computer program for modifying said design data for said level of mask layer according to said defect inspection data;
• and
• a rule set for analyzing said modified design data to determine a final disposition of the mask according to previously established criteria,
• wherein the final disposition of the mask is determined after the defects are classified into critical defects and non-critical defects and by applying different acceptance rules to the critical defects and the non-critical defects.

A computer readable medium comprising code for causing a computer to implement steps of a method for evaluating the effect of defects on masks in a semiconductor manufacturing process, said method comprising:

• inspecting a mask for defects using an inspection tool;
• recording defect inspection data from the inspection tool;
• accessing design data from a design data repository corresponding to a level of a mask layer being inspected;
• modifying said design data for said level of a mask layer according to said defect inspection data;
• analyzing said modified design data;
• classifying the defects into critical defects and non-critical defects based on the analyzing;
• and
• determining a final disposition of the mask by applying different acceptance rules to the critical defects and the non-critical defects.

A method of evaluating the effect of defects on components in a semiconductor manufacturing process, said method comprising:

• inspecting a component for defects using an inspection tool;
• storing defect inspection data from the inspection tool;
• generating shapes representing the defects;
• retrieving design data from a design data repository corresponding to the component being inspected;
• and
• performing an analysis using the design data, the generated shapes, and a pre-determined rule set to determine whether the defects are critical defects and non-critical defects,
• wherein a final disposition of the component is determined by applying different acceptance rules to the critical defects and the non-critical defects.