Thermally enhanced pressure regulation of electronics cooling system
AssigneeAmphenol Corporation
InventorsAndreas C. Pfahnl, Peter Griffith
Life of this patent
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Abstract
A two-phase cooling system operated at atmospheric pressure. A reservoir containing cooling fluid has a stack that is vented to the atmosphere. The stack is shaped to allow condensation of substantially all of the cooling fluid in vapor form entering the stack. Condensation may be enhanced by cooling the stack, such as with flowing air along the outer walls of the stack or placing a thermoelectric device in contact with the stack. The system provides high thermal capacity but is easy to use and service.
Claims27
A cooling system comprising:
- a reservoir to hold cooling fluid;
- a stack coupled to the reservoir to allow gas to exit the reservoir to the ambient environment;
- and
- a means for cooling the stack.
A cooling system comprising:
- a reservoir to hold cooling fluid;
- and
- a stack comprising walls that define first and second openings, wherein the first opening of the stack is coupled to an opening of the reservoir such that gas may enter the stack from the reservoir via the first opening and exit the stack via the second opening;
- wherein the stack is constructed and arranged such that substantially all cooling fluid evaporated in the gas condenses onto the walls of the stack before the gas exits the stack.
A cooling system, comprising:
- a reservoir to hold cooling fluid;
- a stack coupled to the reservoir, the stack comprising walls that define first and second openings, wherein the first opening is coupled to an opening of the reservoir, and wherein a length of the stack is more than ten times greater than a diameter of the second opening;
- and
- at least one valve coupled to the second opening of the stack, the at least one valve being responsive to a pressure difference between the reservoir and the ambient environment, thereby regulating the pressure within the reservoir.
A method of operating an electronic system comprising,
- a) dissipating power as heat in at least one electronic component;
- b) bringing a cooling fluid into thermal contact with the at least one electronic component, the cooling fluid having a boiling point above ambient temperature at atmospheric pressure;
- c) equalizing the pressure of the cooling fluid with the ambient pressure by providing a path to the ambient environment;
- and
- d) condensing substantially all of the cooling fluid in vapor form as it traverses the path towards the ambient environment.
Dependencies are inferred from the claim text.