Heat dissipating device having a fan duct
AssigneesFu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsChun-Chi Chen, Yi-Qiang Wu, Gen-Ping Deng
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AssigneesFu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsChun-Chi Chen, Yi-Qiang Wu, Gen-Ping Deng
Estimating the term…
A heat dissipating device (8) for cooling a number of electronic devices. The heat dissipating device includes a heat sink (7), a fan (6) mounted to a side of the heat sink and a fan duct (5). The heat sink includes a heat spreader (70), a cover (74) and fins (72) disposed between the heat spreader and the cover. The fan duct includes a mounting plate (50), a faceplate (52) extending downwardly from and perpendicular to the mounting plate, and baffle walls (506, 508) extending downwardly from the mounting plate. The mounting plate defines locating holes (540) for permitting screws (82) to pass through the locating holes and to engage with threaded holes (740) defined in the cover. An airflow generated by the fan flows through the fins and an outlet (524) defined between the baffle walls and the heat sink.
A fan duct assembly, comprising:
A heat dissipation device comprising:
A heat dissipating device comprising:
Dependencies are inferred from the claim text.