Semiconductor device having a guard ring
AssigneeFujitsu Limited
InventorsShigetoshi Wakayama, Mutsuaki Kai, Hiroyuki Kato, Masato Suga
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Abstract
A multilayer interconnection structure of a semiconductor device includes a first guard ring extending continuously along a periphery of a substrate and a second guard ring extending continuously in the multilayer interconnection structure along the periphery so as to be encircled by the first guard ring and so as to encircle an interconnection pattern inside the multilayer interconnection structure, wherein the first and second guard rings are connected with each other mechanically and continuously by a bridging conductor pattern extending continuously in a band form along a region including the first and second guard rings when viewed in the direction perpendicular to the substrate.
Claims5
A semiconductor device, comprising:
- a semiconductor substrate;
- and
- a multilayer interconnection structure formed on said semiconductor substrate,
- said multilayer interconnection structure comprising:
- a first guard ring extending continuously in said multilayer interconnection structure along a periphery of said semiconductor substrate;
- and
- a second guard ring extending continuously in said multilayer interconnection structure along said periphery so as to be encircled by said first guard ring, said second guard ring encircling an interconnection pattern inside said multilayer interconnection structure;
- said first and second guard rings being connected with each other mechanically and continuously by a bridging conductor pattern extending continuously in a band form along a region including said first and second guard rings, when viewed in the direction perpendicular to a principal surface of said semiconductor substrate.
Dependencies are inferred from the claim text.