Method of dividing a substrate into a plurality of individual chip parts
AssigneeMicronit Microfluidics B.V.
InventorRonny Van't Oever
Life of this patent
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Abstract
The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid; arranging one or more breaking grooves in the substrate along individual chip parts; applying mechanical force to the substrate to break the substrate along the breaking grooves. The invention also relates to a substrate as well as a chip part.
Claims35
A method for dividing a substrate into a number of individual chip parts, comprising the steps of:
- forming a number of chip parts in the substrate, comprising, for each chip part, recesses in the substrate for containing fluid;
- arranging one or more breaking grooves in the substrate along individual chip parts;
- applying mechanical force to the substrate to break the substrate along the breaking grooves;
- wherein the steps of arranging recesses in the substrate and arranging breaking grooves in the substrate are performed substantially simultaneously, wherein the substrate comprises a first and a second substrate part, and the method further comprises the steps of:
- a) arranging in the first substrate part at least one recess for containing fluid;
- b) arranging in the second substrate part passages to the recess in the first substrate part, wherein a first passage forms a fluid feed and a second passage forms a fluid discharge;
- c) arranging one or more breaking grooves in at least one of the substrate parts;
- d) placing the second substrate part on the first substrate part;
- e) breaking the substrate along the breaking grooves.
A method for dividing a substrate into a number of individual chip parts, comprising the steps of:
- forming a number of chip parts in the substrate, comprising, for each chip part, recesses in the substrate for containing fluid;
- arranging one or more breaking grooves in the substrate along individual chip parts;
- applying mechanical force to the substrate to break the substrate along the breaking grooves;
- removing substrate material by a powder blast process;
- wherein the steps of arranging recesses in the substrate and arranging breaking grooves in the substrate are performed substantially simultaneously.
A method for dividing a substrate into a number of individual chip parts, comprising the steps of:
- forming a number of chip parts in the substrate, comprising, for each chip part, recesses in the substrate for containing fluid;
- arranging one or more breaking grooves in the substrate along individual chip parts, and transport means in the recess for transporting the fluid in the recesses;
- applying mechanical force to the substrate to break the substrate along the breaking grooves;
- wherein the steps of arranging recesses in the substrate and arranging breaking grooves in the substrate are performed substantially simultaneously.
A method for dividing a substrate into a number of individual chip parts, comprising the steps of:
- forming a number of chip parts in the substrate, comprising, for each chip part, recesses in the substrate for containing fluid;
- arranging one or more breaking grooves in the substrate along individual chip parts, wherein the breaking grooves have a depth which corresponds with the thickness of the substrate or the substrate packet;
- applying mechanical force to the substrate to break the substrate along the breaking grooves;
- wherein the steps of arranging recesses in the substrate and arranging breaking grooves in the substrate are performed substantially simultaneously.
A substrate on which a number of chip parts are arranged, wherein a chip part comprises a number of first relatively deep recesses, preferably channel structures for transporting fluid, as well as at least one feed opening and at least one discharge opening for feeding respectively discharging fluid, and comprises one or more second relatively shallow recesses which form breaking grooves extending along the individual chip parts, wherein the breaking grooves are provided for the purpose of dividing the individual chip parts from each other through breaking.
A chip part separated from a substrate, comprising a substrate in which is arranged a number of recesses for containing fluid, which recesses preferably form channel structures for transporting fluid as well as at least one feed opening and at least one discharge opening for feeding respectively discharging fluid, wherein the peripheral surface of the substrate comprises a chamfered edge corresponding with a breaking groove arranged in the upper surface of the substrate and a surface extending under the chamfered edge and defined by breaking of the substrate along the breaking groove.
A method for manufacturing a chip part separated from a substrate, comprising a substrate in which is arranged a number of recesses for containing fluid, which recesses preferably form channel structures for transporting fluid as well as at least one feed opening and at least one discharge opening for feeding respectively discharging fluid, wherein the peripheral surface of the substrate comprises a chamfered edge corresponding with a breaking groove arranged in the upper surface of the substrate and a surface extending under the chamfered edge and defined by breaking of the substrate along the breaking groove.
A chip part separated from a substrate on which a number of chip parts are arranged, wherein a chip part comprises a number of first relatively deep recesses, preferably channel structures for transporting fluid, as well as at least one feed opening and at least one discharge opening for feeding respectively discharging fluid, and comprises one or more second relatively shallow recesses which form breaking grooves extending along the individual chip parts, wherein the breaking grooves are provided for the purpose of dividing the individual chip parts from each other through breaking, the chip part comprising a substrate in which is arranged a number of recesses for containing fluid, which recesses preferably form channel structures for transporting fluid as well as at least one feed opening and at least one discharge opening for feeding respectively discharging fluid, wherein the peripheral surface of the substrate comprises a chamfered edge corresponding with a breaking groove arranged in the upper surface of the substrate and a surface extending under the chamfered edge and defined by breaking of the substrate along the breaking groove.
A method for manufacturing a substrate on which a number of chip parts are arranged, wherein a chip part comprises a number of first relatively deep recesses, preferably channel structures for transporting fluid, as well as at least one feed opening and at least one discharge opening for feeding respectively discharging fluid, and comprises one or more second relatively shallow recesses which form breaking grooves extending along the individual chip parts, wherein the breaking grooves are provided for the purpose of dividing the individual chip parts from each other through breaking.
Dependencies are inferred from the claim text.