Back to results
US 7,256,068 B2Granted
Semiconductor package assembly and method for electrically isolating modules
AssigneeMicron Technology, Inc.
InventorsSion C. Quinlan, Tim J. Bales
Life of this patent
Estimating the term…
Abstract
A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
Claims5
A method of electrically isolating modules within an integrated circuit package assembly, comprising:
- forming a capacitor within the semiconductor package assembly on a first side of a substrate, the capacitor having a first terminal and a second terminal;
- coupling a first module to the first terminal of the capacitor;
- coupling a second module to the second terminal of the capacitor;
- and
- mounting the first and second modules over a second side of the substrate, the second side of the substrate opposite the first side of the substrate.
2 more elements
Dependencies are inferred from the claim text.