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US 7,255,810 B2Granted
Polishing system comprising a highly branched polymer
AssigneeCabot Microelectronics Corporation
InventorsKevin J. Moeggenborg, Fred F. Sun
Life of this patent
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Abstract
The invention provides a polishing system and method of its use comprising (a) a liquid carrier, (b) a polymer having a degree of branching of about 50% or greater, and (c) a polishing pad, an abrasive, or a combination thereof.
Claims23
A polishing system comprising:
- (a) a liquid carrier,
- (b) a branched polymer having a degree of branching of about 50% or greater, and
- (c) a polishing pad, an abrasive, or a combination thereof.
Dependencies are inferred from the claim text.