High performance integrated MLC cooling device for high power density ICS and method for manufacturing

A method for thermally controlling a substrate temperature comprising:

• providing a manifold body of a first manifold attached to a second manifold, said first manifold having a first microjet array and a first drain array both traversing through said first manifold body in a direction parallel to each other and orthogonal to a surface of a substrate, said second manifold having a second microjet array and a second drain array traversing there-through with smaller diameters in comparison to said first microjet array and said first drain array, said second microjet array and said second drain array being respectively in alignment with said first microjet array and said first drain array of said manifold body;
• attaching said manifold body to said substrate surface whereupon a cavity is formed between said manifold body and said substrate surface;
• emitting a liquid from said first and second microjet arrays into said cavity;
• contacting said liquid to said substrate surface for controlling a temperature thereof;
• and
• removing spent said liquid from said cavity in a direction orthogonal to said substrate surface via said first and second drain arrays,
• whereby each said microjet is surrounded by at least three drains to prevent interaction between adjacent microjets.

A liquid impingement manifold apparatus for thermal control of a substrate comprising:

• a manifold body for attachment to a substrate surface;
• a microjet array traversing through said manifold body in a direction orthogonal to said substrate surface;
• a drain array traversing through said manifold body adjacent to and parallel to said microjet array;
• a cavity of said manifold body over said substrate surface;
• a second manifold body attached to said manifold body, said second manifold body having a second microjet array and a second drain array respectively in alignment with said microjet array and said drain array of said manifold body, said second microjet array and said second drain array having different dimensions in comparison to said microjet array and said drain array of said manifold body
• whereby said microjet arrays emit a liquid into said cavity for contact with said substrate surface for thermal control thereof while said drain arrays remove spent liquid from said cavity in said direction orthogonal to said substrate surface.

A method for thermally controlling a substrate temperature comprising:

• providing a manifold body having a microjet array and a drain array both traversing through said manifold body in a direction parallel to each other and orthogonal to a surface of a substrate;
• attaching said manifold body to said substrate surface whereupon a cavity is formed between said manifold body and said substrate surface, said cavity comprises a plurality of first cavities all opening into a second cavity;
• providing a gas microjet array within said manifold body, said microjet array and said gas microjet array having ends opening into said plurality of first cavities whereby each first cavity has a microjet adjacent at least one gas microjet;
• emitting a liquid from said microjet array and a gas from said gas microjet array within said plurality of first cavities;
• mixing said liquid and said gas within said plurality of first cavities to form an atomized liquid spray;
• transferring said atomized liquid spray from said plurality of first cavities into said second cavity;
• contacting said substrate surface with said atomized liquid spray within said second cavity for controlling a temperature thereof;
• and
• removing spent vaporized liquid molecules from said second cavity in a direction orthogonal to said substrate surface via said drain array,
• whereby each said microjet is surrounded by at least three drains to prevent interaction between adjacent microjets.