Thermal management for shielded circuit packs

A heat transfer device comprising:

• a heat-dissipating structure thermally connected to a particular one heat source of a plurality of heat sources, and
• a gasket disposed between, and in contact with, said heat-dissipating structure and a select area of an EMI shield enclosure;
• and
• wherein said gasket is mechanically-compliant, electrically-conductive and integral with said EMI shield enclosure;
• and
• wherein the heat transfer device comprises:
• a plurality of heat-dissipating structures, each one of said heat-dissipating structures being in thermal contact with a different one of said heat sources;
• a plurality of gaskets such that each gasket is disposed between, and in contact with, a different one of said heat sources and a particular area of said EMI shield enclosure;
• and
• wherein said gaskets are mechanically-compliant, electrically-conductive, integral with said EMI shield enclosure and compensate for any height variations between said mounted heat sources in said EMI shield enclosure.

A circuit packet assembly comprising:

• a printed circuit board (PCB);
• a plurality of integrated circuits mounted on said PCB;
• an EMI shield, said EMI shield providing an enclosure to said PCB;
• a plurality of heat sinks, each one of said heat sinks being associated with, and thermally connectable to, a different one integrated circuit of said plurality of integrated circuits;
• a plurality of gaskets, each one of said gaskets being disposed between, and in contact with, a particular one heat sink of said plurality of heat sinks and said EMI shield;
• and
• wherein said gaskets are mechanically-compliant, electrically-conductive, form part of said EMI shield and compensate for any height variations between said mounted integrated circuits within said EMI enclosure.

A heat transfer method for use with an EMI shield, the method comprising the steps of:

• thermally connecting a first heat-dissipating structure to a first heat source, and thermally connecting a second heat-dissipating structure to a second heat source, said first and said second heat-dissipating structures each having at least one heat-transfer fin;
• and
• disposing a first gasket between, and in contact with, said first heat-dissipating structure and a first select area of said EMI shield such that said heat-transfer fin of said first-heat dissipating structure extends through said first select area of said EMI shield;
• and
• disposing a second gasket between, and in contact with, said second heat-dissipating structure and a second select area of said EMI shield such that said heat-transfer fin of said second heat-dissipating structure extends through said second select area of said EMI shield;
• and
• wherein said first and said second gaskets are mechanically-compliant, electrically-conductive, integral with said EMI shield and compensate for any height variations between said first heat source and said second heat source within said EMI shield.