Integrated circuit chip having a seal ring, a ground ring and a guard ring
AssigneeAiroha Technology Corp.
InventorSheng-Yow Chen
Life of this patent
Estimating the term…
Abstract
An integrated circuit chip is provided. The chip includes a silicon substrate, a circuit, a seal ring, a ground ring and a guard ring. The circuit is formed on the silicon substrate and has an input/output (I/O) pad. The seal ring is formed on the silicon substrate and surrounds the circuit and the I/O pad. The ground ring is formed between the silicon substrate and the I/O pad, and the ground ring is electrically connected with the seal ring. The guard ring is formed above the silicon substrate and surrounds the I/O pad, and the guard ring is electrically connected with the seal ring.
Claims19
An integrated circuit chip comprising:
- a silicon substrate;
- a circuit formed of the silicon substrate and having an input/out (I/O) pad;
- a seal ring formed on the silicon substrate and substantially surrounding the circuit and the I/O pad;
- a ground ring formed on the silicon substrate and electrically connected with the seal ring, wherein the around ring is formed within an inner side of the seal ring;
- and
- a guard ring formed on the silicon substrate and electrically connected with the seal ring,
- wherein an enclosed region is enclosed by the guard ring and the seal ring, the enclosed region is adjacent to and between the guard ring and the seal ring, and the I/O pad is formed within the enclosed region.
An integrated circuit chip comprising:
- a silicon substrate;
- a first seal ring, which substantially extends along the peripheral of the silicon substrate;
- a around ring electrically connected with the first seal ring and formed within an inner side of the first seal ring;
- a first guard ring, which is formed near the first seal ring and is electrically connected with the first seal ring, wherein the first guard ring is substantially a U-shaped structure, wherein a first enclosed region is enclosed by the first guard ring and part of the first seal ring, and the first enclosed region is adjacent to and between the first guard ring and the first seal ring;
- and
- a first I/O pad formed within the first enclosed region.
An integrated circuit comprising:
- a silicon substrate;
- a seal ring substantially extending along the peripheral of the silicon substrate;
- a ground ring formed on the silicon substrate and electrically connected with the seal ring, wherein the around ring is formed within an inner side of the seal ring;
- a first guard ring substantially linearly extended on the silicon substrate and having two ends, the first guard ring electrically connected with the seal ring at the two ends to define a first enclosed region enclosed between the first guard ring and the seal ring;
- and
- a first circuit formed on the silicon substrate, and the first circuit having a first input/output (I/O) pad formed within the first enclosed region.
Dependencies are inferred from the claim text.