Abrasive composition for the integrated circuit electronics industry
AssigneeAZ Electronic Materials USA Corp.
InventorsEric Jacquinot, Pascal Letourneau, Maurice Rivoire
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Abstract
Abrasive composition for the integrated circuits electronics industry comprising an aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds and an abrasive surfactant, this abrasive being for mechanical chemical polishing in the integrated circuits industry, comprising a fabric impregnated by such a composition, and a process for mechanical chemical polishing.
Claims14
An abrasive composition for the integrated circuit electronics industry, comprising an aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, and a surfactant.
An abrasive for mechanical chemical polishing in the integrated circuits industry, comprising a fabric impregnated with an aqueous acid suspension of colloidal silica of pH between 1 and 5 containing individualized particles not linked to each other by siloxane bonds of diameter comprised between 12 and 100 nm and a surfactant.
Dependencies are inferred from the claim text.