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US 7,248,481 B2Granted
Circuit board and system with a multi-portion socket
AssigneeIntel Corporation
InventorMark B. Trobough
Life of this patent
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Abstract
Circuit board and system with multi-portion sockets, and signal methods practiced thereon are described herein.
Claims12
A circuit board apparatus, comprising:
- a first substrate comprised of a first material;
- a first portion of a socket having a first plurality of contacts coupled to the first substrate,
- a second portion of the socket having a second plurality of contacts, the second portion being mated to the first portion of the socket, the first plurality of contacts to cooperate with at least the second plurality of contacts of the second portion of the socket to provide electrical contacts for an electronic component to be mated with the socket;
- and
- a second substrate comprised of a second material coupled to the second portion of the socket, the first material to facilitate signals destined for or originating from the electronic component at a first signaling speed, the second material to facilitate signals destined for or originating from the electronic component at a second signaling speed, the second signaling speed being greater than the first signaling speed.
2 more elements
Dependencies are inferred from the claim text.