Thermal management for hot-swappable module
AssigneeIntel Corporation
InventorsMark D. Summers, Lawson Guthrie, William Handley
Life of this patent
Estimating the term…
Abstract
A method according to one embodiment may include providing a heat generating component disposed on a first side of a first circuit board, and transferring heat from the heat generating component through the first circuit board to a second side of the first circuit board. The method according to this embodiment may further include slidingly thermally coupling the second side of the first circuit board to a thermal solution disposed on a second circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
Claims20
A system comprising:
- a chassis comprising a first circuit board comprising an advanced telecommunications computing architecture form factor, said first circuit board comprising a thermal solution;
- a second circuit board comprising at least one heat generating component disposed on a first side of said second circuit board,
- a thermally conductive pathway thermally coupled to said heat generating component, said thermally conductive pathway extending from said first side of said second circuit board to a second side of said second circuit board;
- a thermal interface device disposed on said second side of said circuit board and thermally coupled to said thermally conductive pathway capable of slidably thermally coupling to said thermal solution.
An apparatus comprising:
- a first circuit board comprising a thermal solution
- a second circuit board comprising at least one heat generating component disposed on a first side of said second circuit board,
- a thermally conductive pathway thermally coupled to said heat generating component, said thermally conductive pathway extending from said first side of said second circuit board to a second side of said second circuit board;
- and
- a thermal interface device disposed on said second side of said circuit board and thermally coupled to said thermally conductive pathway, said thermal interface device capable of slidingly thermally coupling to said thermal solution.
A method of dissipating heat comprising:
- providing a heat generating component disposed on a first side of a first circuit board
- transferring heat from said heat generating component through said first circuit board to a second side of said first circuit board;
- slidingly thermally coupling said second side of said first circuit board to a thermal solution disposed on a second circuit board.
Dependencies are inferred from the claim text.