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US 7,247,927 B2Granted
Leadframe alteration to direct compound flow into package
AssigneeMicron Technology, Inc.
InventorStephen L. James
Life of this patent
Estimating the term…
Abstract
A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of the frame at a first transition point. The upward slope facilitates the upward flow of the molding compound entering from a bottom gate. Likewise, the leadframe also directs flow in a top gated mold by reversing the orientation of the leadframe or by forming a reverse downset on the leadframe.
Claims12
A leadframe comprising:
- a die paddle adapted to receive a die;
- a plurality of spaced lead fingers positioned about the die paddle;
- an offset formed in the leadframe, said offset is configured such that when an encapsulating material is being injection molded to the leadframe from an injection entry port located adjacent to a first surface of the leadframe, said offset induces a portion of the encapsulating material to flow through a plurality of spaces between the plurality of lead fingers from the first surface of the lead frame to a second surface, wherein said first and second surfaces are opposing surfaces.
Dependencies are inferred from the claim text.