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US 7,247,575 B2Granted
Multi-step EBR process for photoresist removal
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChiu Sung Cheng, Wu Ming Che, Hung Shih Lei, Huang Ching Juinn
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Abstract
An edge bead removal process is disclosed. The process includes providing a wafer having a feature layer, coating a photoresist on the feature layer, rotating the wafer, and removing an edge bead from the wafer by removing an edge bump portion from the edge bead and removing an edge region from the edge bead.
Claims20
An edge bead removal process, comprising:
- providing a wafer having a feature layer;
- coating a photoresist on said feature layer;
- rotating said wafer, whereby an edge bead comprising said photoresist forms on said feature layer;
- removing an edge bump portion comprising said edge bead;
- and
- removing an edge region thickness underlying said edge bump portion comprising said edge bead to expose said feature layer following removing said edge bump portion.
3 more elements
A process for reducing defects and enhancing yield of devices on a wafer, comprising:
- providing a wafer having a feature layer;
- coating a photoresist on said feature layer;
- rotating said wafer, whereby an edge bead comprising said photoresist forms on said feature layer;
- removing an edge bump portion extending above an upper plane of said photoresist overlying an edge region thickness comprising said edge bead;
- removing said edge region thickness to expose said feature layer following removing said edge bump portion;
- and
- completing fabrication of devices on said wafer.
4 more elements
An edge bead removal process, comprising:
- providing a wafer having a feature layer;
- coating a photoresist on said feature layer;
- rotating said wafer, whereby an edge bead comprising said photoresist forms on said feature layer;
- imparting a generally planar configuration to said photoresist by removing an edge bump portion extending above an upper plane of said photoresist, said edge bump portion overlying an edge region thickness comprising said edge bead;
- and
- removing said edge region thickness to expose said feature layer following removal of said edge bump portion.
3 more elements
Dependencies are inferred from the claim text.