Heatsink for power devices
AssigneeIXYS Corporation
InventorCharles Coleman
Life of this patent
Estimating the term…
Abstract
A heatsink for a power device comprises an upper conductive plate providing a first surface; a lower conductive plate providing a second surface; a middle conductive plate provided between the upper and lower plates, the middle plate having a hollow portion and a solid portion, the hollow portion defining an area to receive coolant, wherein the power device is provided on the first or second surface, so that heat generated by the power device can be transferred to the coolant. The heatsink further comprises an input port coupled to the hollow portion of the middle plate to provide the coolant into the hollow portion; and an output port coupled to the hollow portion of the middle plate to remove the coolant from the hollow portion.
Claims20
A heatsink for a power device, the heatsink comprising:
- an upper plate providing a first surface;
- a lower plate providing a second surface;
- a middle plate provided between the upper and lower plates, the middle plate having a hollow portion and a solid portion, the hollow portion defining an area to receive coolant;
- and
- one or more strips provided within the area defined by the hollow portion to provide structural reinforcement to the heatsink,
- wherein the power device is provided on the first or second surface, so that heat generated by the power device can be transferred to the coolant.
A heatsink for a power device, the heatsink comprising:
- an upper conductive plate providing a first surface;
- a lower conductive plate providing a second surface;
- a middle conductive plate provided between the upper and lower plates, the middle plate having a hollow portion and a solid portion, the hollow portion defining an area to receive coolant, and
- one or more holes that extends from the first surface to the second surface,
- wherein the power device is provided on the first or second surface, so that heat generated by the power device can be transferred to the coolant,
- wherein the power device is attached to the first surface and another power device is provided on the second surface, wherein the one or more holes are used to provide wiring between the two power devices.
Dependencies are inferred from the claim text.