Electronic device including chip parts and a method for manufacturing the same

An electronic device, comprising:

• a chip part having an upper surface;
• a mounting substrate having a mounting surface and a ground layer, wherein the chip part is mounted on the mounting surface of the mounting substrate;
• and
• a shielding conductor comprising:
• a ceiling plate section united with the upper surface of the chip part and covering the chip part;
• and
• opposed side plate sections united with and extending below the ceiling plate section and projecting in a horizontal direction around two sides of the chip part,
• wherein the shielding conductor forms openings in a front-rear direction of the shielding conductor and a front-rear direction of the chip part;
• wherein the opposed side plate sections of the shielding conductor are electrically connected to the ground layer of the mounting substrate via a plurality of connecting means extending in a front-rear direction;
• and
• wherein a width W of the ceiling plate section in a front-rear direction is sized greater than or equal to twice a harmonic mean of a length L of the openings in a horizontal direction between the opposed side plate sections and a height H of the ceiling plate section in a vertical direction above the mounting substrate.

An electronic device, comprising:

• a chip part having an upper surface;
• a mounting substrate having a mounting surface and a ground layer, wherein the chip part is mounted on the mounting surface of the mounting substrate;
• a shielding conductor comprising:
• a ceiling plate section united with the upper surface of the chip part and covering the chip part;
• opposed side plate sections united with and extending below the ceiling plate section and projecting in a horizontal direction around two sides of the chip part;
• and
• opposed opening end sections projecting in a front-rear direction of the shielding conductor and the chip part;
• wherein the opposed side plate sections are electrically connected to the ground layer of the mounting substrate via a plurality of connecting means extending in the front-rear direction;
• and
• an electromagnetic wave absorber disposed between the chip part and at least one of the opposed opening end sections of the shielding conductor,
• wherein a width W of the ceiling plate section in a front-rear direction is sized greater than or equal to twice a harmonic mean of a length L of the ceiling plate section in a horizontal direction between the opposed side plate sections and a height H of the ceiling plate section in a vertical direction above the mounting substrate.

A method of manufacturing an electronic device including a chip part mounted on a surface of a mounting substrate, a shielding conductor united with and covering an upper surface of the chip part, wherein the shielding conductor is electrically connected to a ground layer of the mounting substrate, the method of manufacturing comprising:

• assembling the chip part with the shielding conductor into a unit, the shielding conductor including a ceiling plate section united to and covering the chip part, and opposed side plate sections united with the ceiling plate section and extending below the ceiling plate section and projecting in a horizontal direction around two sides of the chip part;
• arranging on the mounting substrate in which the ground layer is formed the shielding conductor assembled with the chip part into the unit;
• mounting the chip part on a surface of the mounting substrate, and electrically connecting the shielding conductor to the ground layer at the same time, and
• sizing a width W of a ceiling plate section of a shielding conductor in a front-rear direction greater than or equal to twice a harmonic mean of a length L of the ceiling plate section in a horizontal direction between opposed side plate sections and a height H of the ceiling plate section in a vertical direction above the mounting substrate.

A method of manufacturing an electronic device including a chip part mounted on a surface of a mounting substrate, a shielding conductor united with and covering an upper surface of the chip part, wherein the shielding conductor is electrically connected to a ground layer of the mounting substrate, the method of manufacturing comprising:

• arranging the chip part on the mounting substrate on which a ground layer is formed, and mounting the chip part on a surface of the mounting substrate;
• and
• sizing a width W of a ceiling plate section of a shielding conductor in a front-rear direction greater than or equal to twice a harmonic mean of a length L of the ceiling plate section in a horizontal direction between opposed side plate sections and a height H of the ceiling plate section in a vertical direction above the mounting substrate, wherein the opposed side plate sections are united with the ceiling plate section and extend below the ceiling plate section and project in a horizontal direction around two sides of the chip part;
• arranging the shielding conductor on the mounting substrate;
• electrically connecting the shielding conductor to the ground layer;
• and
• covering an upper surface of the chip part with the ceiling plate section.