Copper-tin-oxygen alloy plating
AssigneesNihon New Chrome Co., Ltd., YKK Snap Fasteners Japan Co., Ltd.
InventorsKazuya Urata, Kazuhiro Kitagawa, Yukio Ogawa, Kenji Hasegawa
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Abstract
The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.
Claims13
An ornamental article having Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at % in the plating, wherein said plating is applied to said ornamental article and said ornamental article is made from material selected from a group consisting of metal materials, ceramic materials, plastic materials, or ceramic or plastic materials on which a metal plating has been applied in advance,
- wherein said ornamental article is a costumery article or a toy.
An ornamental article having Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at % in the plating, wherein said plating is applied to said ornamental article and said ornamental article is made from material selected from a group consisting of metal materials, ceramic materials, plastic materials, or ceramic or plastic materials on which a metal plating has been applied in advance, wherein said ornamental article is a snap button.
Dependencies are inferred from the claim text.