Real-time mathematical model for wafer spin defect detection and for misalignment analyses
AssigneeTexas Instruments Incorporated
InventorsAditya Chityala, Errol Philip Akomer, Jason Charles Tervooren
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AssigneeTexas Instruments Incorporated
InventorsAditya Chityala, Errol Philip Akomer, Jason Charles Tervooren
Estimating the term…
According to various embodiments, there is a method of inspecting semiconductor wafers comprising comparing a value for each wafer in a lot of wafers to a mathematical model, where the values include data about at least one feature on the wafers, and where the mathematical model comprises a threshold value corresponding to the at least one feature, and further where values greater than the threshold value comprise an indication of a spin defect. The method can also comprise determining whether any of the values of the wafers in the lot are not greater than the threshold value, grouping into a group (P) those wafers whose values are not greater than the threshold value, and flagging for further inspection those wafers having values greater than the threshold value.
A method of inspecting semiconductor wafers comprising:
A method of inspecting semiconductor wafers comprising:
A computer readable storage medium containing program code for enabling a computer for use in inspecting semiconductor wafers, the program code comprising:
Dependencies are inferred from the claim text.