Electronic packages, assemblies, and systems with fluid cooling

An electronic assembly comprising:

• an integrated circuit package including
• a heat spreader having a surface with a channel formed therein to conduct a fluid;
• a thinned semiconductor die, wherein the die has a geometry of a first size,
• wherein the channel has a geometry of a second size greater than the first size;
• a thermal interface material coupling the die directly to the surface of the heat spreader;
• and
• a core element, laterally adjacent to the die, to overlap a portion of the channel not overlapped by the die;
• and
• a pump coupled to the channel to circulate a fluid therein.

An electronic system comprising:

• a bus coupling components in the electronic system;
• a display coupled to the bus;
• an external memory coupled to the bus;
• a processor coupled to the bus and having an electronic assembly including at least one integrated circuit package having
• a heat spreader having a surface with a channel formed therein to conduct a fluid;
• a thinned semiconductor die, wherein the die has a geometry of a first size, wherein the channel has a geometry of a second size greater than the first size;
• a thermal interface material coupling the die directly to the surface of the heat spreader;
• and
• a core element, laterally adjacent to the die, to overlap a portion of the channel not overlapped by the die;
• and
• a pump coupled to the channel to circulate a fluid therein.