US 7,126,359 B2Granted

Device monitor for RF and DC measurement

AssigneeNational Applied Research Laboratories

InventorsGuo-Wei Huang, Kun-Ming Chen, Da-Yuan Chiu, Sheng-Yu Wen, Ming-Hsiang Cho, Sheng-Chun Wang, Yu-Ming Teng, Chia-Sung Chiu

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Abstract

A device monitor for RF and DC measurement. The device monitor comprises a plurality of test cells arranged substantially in line. The test cell comprises a device under test, an input pad, an output pad and at least two reference pads. The input pad is electrically connected to an input of the DUT. The output pad is electrically connected to an output of the DUT. At least one of the reference pads is electrically connected to the DUT to provide a reference level. The input pad, the output pad and the reference pads are arranged substantially in line and at least one of the reference pads is located between the input pad and the output pad.

Claims10

Dependent claims

A device monitor for RF and DC measurement, coupled to a measurement instrument via a probe, the device monitor comprising:

a plurality of test cells arranged substantially in line, wherein each test cell comprises:
a device under test (DUT);
an input pad, connected to an input of the device under test (DUT) and coupled to an output port of the measurement instrument via the probe;
an output pad, connected to an output of the device under test (DUT) and coupled to an input port of the measurement instrument via the probe;
a plurality of reference pads, connected to the device under test (DUT) and coupled to a reference potential of the measurement instrument via the probe;
wherein the input pad, the output pad and the reference pads are arranged substantially in line and only one of the reference pads is disposed between the input pad and the output pad.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 11/008,458Filed 9 Dec 2004
Priority: TW 93104737 A25 Feb 2004
Published: US 2005/0184742 A125 Aug 2005
Granted: 24 Oct 2006
Term ends: Not estimatedThe source records don’t support an estimate.

Classification4 codes

G01R 31/2884
Testing of integrated circuits [IC]: using dedicated test connectors, test elements or test circuits on the IC under test
H10P 74/277
Structural arrangements therefor: circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or…
G01R
Measuring electric variables
H10P
Generic processes or apparatus for the manufacture or treatment of devices covered