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US 7,126,063 B2Granted
Encapsulated electronic sensor package
AssigneeTyco Electronics Canada, Ltd.
InventorsAdam Weisz-Margulescu, Alan Albino, Roger Robichaud
Life of this patent
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Abstract
An electronic package includes a circuit board and a capsule layer encasing the circuit board and forming an immersible electronic module. A housing receives the electronic module and forms a protective shell around the electronic module.
Claims9
An electronic package comprising:
- a circuit board;
- a compressible capsule layer encasing said circuit board and in intimate contact therewith, thereby forming a sealed immersible electronic module;
- and
- a housing receiving an outer surface of and press fit to said encapsulated electronic module and forming a protective shell around said electronic module with press fit engagement.
1 more element
Dependencies are inferred from the claim text.