Integrated electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsKeiji Ogawa, Mitsuhide Kato, Yoshinori Yamada
Life of this patent
Estimating the term…
Abstract
An integrated electronic component includes a ceramic substrate incorporating circuit elements and/or having circuit elements mounted thereon, and a metal case mounted on the ceramic substrate. Notches are formed in substrate-facing segments of the metal case at the positions opposing the corners of the top surface of the ceramic substrate. The notches have a tapered shape having obtuse angles with respect to the top surface of the substrate. The notches may have a substantially circular arc shape. The substrate-facing segments having the notches are seamlessly connected to side segments of the metal case, bent in the vicinity of the notches, and supported by the bent portions in a cantilevered fashion.
Claims23
An integrated electronic component comprising:
- a ceramic substrate including circuit elements and external electrodes disposed on side surfaces of the ceramic substrate;
- and
- a metal case having a top segment and substrate-facing segments and being mounted on the ceramic substrate;
- wherein
- bottom edges of the substrate-facing segments oppose a top surface of the ceramic substrate, the substrate-facing segments have notches at positions opposing corners of the top surface of the ceramic substrate, and the notches have a tapered shape having obtuse angles with respect to the bottom edges of the substrate-facing segments;
- and
- the external electrodes are not disposed in the corners of the top surface of the ceramic substrate.
An integrated electronic component comprising:
- a ceramic substrate including circuit elements and external electrodes disposed on side surfaces of the ceramic substrate;
- and
- a metal case having a top segment and substrate-facing segments and being mounted on the ceramic substrate;
- wherein
- bottom edges of the substrate-facing segments oppose a top surface of the ceramic substrate, the substrate-facing segments have notches at positions opposing corners of the top surface of the ceramic substrate, and the notches have a substantially circular arc shape;
- and
- the external electrodes are not disposed in the corners of the top surface of the ceramic substrate.
An integrated electronic component comprising:
- a ceramic substrate including circuit elements;
- and
- a metal case having a top segment and substrate-facing segments and being mounted on the ceramic substrate;
- wherein
- bottom edges of the substrate-facing segments oppose a top surface of the ceramic substrate, the substrate-facing segments have notches at positions opposing corners of the top surface of the ceramic substrate, and the notches have a tapered shape having obtuse angles with respect to the bottom edges of the substrate-facing segments;
- and
- a portion of a top edge of each of the substrate-facing segments is spaced from a bottom surface of the top segment.
An integrated electronic component comprising:
- a ceramic substrate including circuit elements;
- and
- a metal case having a top segment and substrate-facing segments and being mounted on the ceramic substrate;
- wherein
- bottom edges of the substrate-facing segments oppose a top surface of the ceramic substrate, the substrate-facing segments have notches at positions opposing corners of the top surface of the ceramic substrate, and the notches have a substantially circular arc shape;
- and
- a portion of a top edge of each of the substrate-facing segments is spaced from a bottom surface of the top segment.
An integrated electronic component comprising:
- a ceramic substrate including circuit elements;
- and
- a metal case having a top segment and substrate-facing segments and being mounted on the ceramic substrate;
- wherein
- bottom edges of the substrate-facing segments oppose a top surface of the ceramic substrate, the substrate-facing segments have notches at positions opposing comers of the top surface of the ceramic substrate, and the notches have a tapered shape having obtuse angles with respect to the bottom edges of the substrate-facing segments;
- and
- the metal case includes side segments, the substrate-facing segments are seamlessly connected to the side segments at positions opposing the corners of the top surface of the ceramic substrate, such that the substrate-facing segments are supported at borders with the side segments in a cantilevered fashion.
An integrated electronic component comprising:
- a ceramic substrate including circuit elements;
- and
- a metal case having a top segment and substrate-facing segments and being mounted on the ceramic substrate;
- wherein
- bottom edges of the substrate-facing segments oppose a top surface of the ceramic substrate, the substrate-facing segments have notches at positions opposing corners of the top surface of the ceramic substrate, and the notches have a substantially circular arc shape;
- and
- the metal case includes side segments, the substrate-facing segments are seamlessly connected to the side segments at positions opposing the corners of the top surface of the ceramic substrate, such that the substrate-facing segments are supported at borders with the side segments in a cantilevered fashion.
Dependencies are inferred from the claim text.