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US 7,120,022 B2Granted
Loop thermosyphon with wicking structure and semiconductor die as evaporator
AssigneeHewlett-Packard Development Company, L.P.
InventorsChristian L. Belady, Roy Zeighami
Life of this patent
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Abstract
A loop thermosyphon system has a semiconductor die with a plurality of microchannels. A condenser is in fluid communication with the microchannels. A wicking structure wicks fluid between the condenser to the semiconductor die.
Claims28
A loop thermosyphon system, comprising:
- a semiconductor die having a plurality of microchannels;
- a condenser in fluid communication with the microchannels;
- and
- wicking structure to wick fluid from the condenser to the semiconductor, the wicking structure being selected from the group comprising porous-like material, powder, fiber, screen and mixtures thereof;
- wherein the fluid dissipates heat away from the semiconductor die.
2 more elements
A method of cooling a semiconductor die, comprising:
- wicking fluid from a condenser, for input to one or more microchannels of a semiconductor die, the step of wicking comprising utilizing wicking structure being selected from the group comprising porous-like material, powder, fiber, screen and mixtures thereof;
- communicating heated fluid from the die to the condenser;
- and
- cooling fluid at the condenser;
- wherein the fluid transfers heat away from the semiconductor die.
2 more elements
A loop thermosyphon system, comprising:
- a semiconductor die having a plurality of microchannels;
- fluid-flow restrictive material at an input to at least one of the microchannels, for preferential fluid flow along one direction of the at least one microchannel;
- and
- a condenser in fluid communication with the microchannels, to cool heated fluid from the die for input to the microchannels.
1 more element
A method of cooling a semiconductor die, comprising:
- wicking fluid from a condenser, for input to one or more microchannels of a semiconductor die;
- placing fluid-flow restrictive material at an input to one or more of the microchannels, for preferential fluid flow along the one or more microchannels;
- communicating heated fluid from the die to the condenser;
- and
- cooling fluid at the condenser;
- wherein the fluid transfers heat away from the semiconductor die.
3 more elements
Dependencies are inferred from the claim text.