Electronic assemblies with high capacity bent fin heat sinks
AssigneeIntel Corporation
InventorsDaniel P. Carter, Michael T. Crocker
Life of this patent
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Abstract
An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.
Claims28
A heat sink for use with an axial flow fan comprising:
- a core having a central axis;
- and
- a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the core substantially parallel to the central axis, wherein the fins are shaped to capture a tangential component of air from the fan, and wherein an upper portion of each of the fins is bent towards the tangential component.
A heat sink for use with an axial flow fan comprising:
- a core having a central axis;
- and
- a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the care substantially parallel to the central axis, wherein the fins are shaped to capture a tangential component of air from the fan, wherein the core is shaped to maximize the number of fins while maintaining a substantially uniform aspect ratio in the fins, and wherein an upper portion of each of the fins is bent towards the tangential component.
An electronic assembly comprising:
- a substrate;
- an electronic component mounted on a surface of the substrate;
- an axial flow fan to move air towards the substrate, the air having an axial component and a tangential component;
- and
- a heat sink including
- a first face in thermal contact with the electronic component;
- a second face facing the fan;
- a core having a central axis;
- and
- a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the core substantially parallel to the central axis, wherein the fins are shaped to capture both components of air, and wherein an upper portion of each of the fins is bent towards the tangential component.
An electronic system comprising:
- a circuit board;
- a processor integrated circuit (IC) mounted on the circuit board;
- at least one chipset mounted on the circuit board and electrically coupled to the processor IC for operation in conjunction with the processor IC;
- at least one axial flow fan to move air towards the circuit board, the air having both an axial component and a tangential component;
- and
- at least one heat sink including
- a first face in thermal contact with either the processor IC or the chipset;
- a second face facing the at least one fan;
- a core having a central axis;
- and
- a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the core substantially parallel to the central axis, wherein the fins are shaped to capture both components of air, wherein the core is shaped to maximize the number of fins while maintaining a substantially uniform aspect ratio in the fins, and wherein an upper portion of each of the fins is bent towards the tangential component.
A heat sink comprising:
- a core having a central axis, and having a surface to thermally contact a heat-generating electrical component;
- a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the core substantially parallel to the central axis, and wherein an upper portion of each of the fins is bent in the same relative direction;
- and
- a first face having a periphery defined by the fin tips, wherein the first face is to face the component, and wherein the first face comprises inter-fin openings.
A heat sink comprising:
- a core having a central axis, and having a surface to thermally contact a heat-generating electrical component;
- a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the core substantially parallel to the central axis, wherein each fin comprises a vertical portion and an angled portion, and wherein the angled portion of each fin is bent in the same relative direction;
- and
- a first face having a periphery defined by the fin tips, wherein the first face is to face the component, and wherein the first face comprises inter-fin openings.
Dependencies are inferred from the claim text.